cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 1/7 MBR05200J3 cystek product specification 5amp. schottky barrier rectifiers i f(av) 5a MBR05200J3 v rrm 200v tj 175 c v f 0.7v features ? 175 operating junction temperature ? low v f and low i r type ? metal silicon junction, major carrier conduction ? guardring for over voltage protection ? low power loss, high efficiency ? high surge capability ? for use in low voltage, high frequency inverters, free wheeling, and polarit y protection application ? pb-free lead plating an d halogen-free package mechanical data ? case: to-252 molded plastic ? mounting position: any ? weight: 0.34 grams approximately ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? polarity : indicated by diode symbol equivalent circuit outline to-252 MBR05200J3 a k a
cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 2/7 MBR05200J3 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 200 v maximum rms voltage v rms 140 v maximum dc blocking voltage v dc 200 v i f =5a, t c =25 0.90 maximum instantaneous forward voltage at (note 1) i f =5a, t c =125 v f 0.7 0.74 v maximum average forward rectified current @ t c =133 i f(av) 5 a peak repetitive forward current (square wave, 20khz, t c =133) i frm 10 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 110 a peak repetitive reverse surge current (note 1 ), t j <175 i rrm 2 a v r =200 v, t c =25 5 a maximum instantaneous reverse current at v r =200 v, t c =125 i r 5 ma voltage rate of change, (rated v r ) dv/dt 10,000 v/ s typical junction capacitance @ f=1mhz and applied 5v reverse voltage c j 65 pf esd susceptibility (note 2) 8000 v storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 notes : 1. 2.0 s pulse width, f=1.0khz 2. human body model, 1.5k in series with 100pf thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 2.5 c/w maximum thermal resistance, junction-to-ambient r th,j-a 125 c/w ordering information device package shipping MBR05200J3 to-252 (pb-free lead plating an d halogen-free package) 2500 pcs / tape & reel
cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 3/7 MBR05200J3 cystek product specification characteristic curves forward current derating curve 0 1 2 3 4 5 6 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---if (av) (a) resistive or inductive load maximum non-repetitive forward surge current 0 50 100 150 200 1 10 100 number of cycles at 60hz peak forward surge current---i fsm (a) tj=150, 8.3ms single half sine wave, jedec method forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (a) tj=75 t j =25 tj=125
cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 4/7 MBR05200J3 cystek product specification recommended soldering footprint
cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 5/7 MBR05200J3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 6/7 MBR05200J3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cystech electronics corp. spec. no. : c462j3 issued date : 2009.11.18 revised date : page no. : 7/7 MBR05200J3 cystek product specification to-252 dimension 3-lead to-252 plastic surface mount package cystek package code: j3 marking: b a c e h i j k 3 2 1 d f g l cys 05200 style: pin 1.anode 2.cathode 3.anode *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0157 0.0236 0.40 0.60 g 0.0984 0.1142 2.50 2.90 b 0.0591 0.0827 1.50 2.10 h - *0.0906 - *2.30 c 0.0157 0.0315 0.40 0.80 i 0.0315 0.0394 0.80 1.00 d 0.0157 0.0236 0.40 0.60 j 0.0315 0.0394 0.80 1.00 e 0.2480 0.2638 6.30 6.70 k 0.2008 0.2165 5.10 5.50 f 0.2283 0.2441 5.80 6.20 l 0.0315 0.0394 0.80 1.00 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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